Qualcomm and TDK have formed a joint venture called RF360 Holdings Singapore. This new corporation will take advantage of Qualcomm’s Radio Frequency Front-End technologies in order to further integrate them into mobile devices, cars, IoT-enabled devices and more. RF360 Holdings will have a comprehensive set of filters and filter technologies, including surface acoustic wave (SAW), temperature compensated surface acoustic wave (TC-SAW) and bulk acoustic wave (BAW), to support the wide range of frequency bands being deployed in networks around the globe.

In addition to operating the joint venture, Qualcomm and TDK will deepen their technological cooperation to cover a wide range of cutting-edge tech for next-gen mobile communications.