Western Digital has announced that it has successfully developed its next generation 3D NAND technology, BiCS3, with 64 layers of vertical storage capability. Pilot production of the new technology has commenced in the Yokkaichi, Japan joint venture facilities and initial output is expected later this year with commercial availability expected first half of next year.

According to Dr. Siva Sivaram, executive vice president, memory technology “BiCS3 will feature the use of 3-bits-per-cell technology along with advances in high aspect ratio semiconductor processing to deliver higher capacity, superior performance and reliability at an attractive cost. Customer applications include those in retail, mobile and data center.

The product will be initially deployed in 256 gigabit capacity and will be available in a range of capacities up to half a terabit on a single chip. Volume shipments for the retail market will be in the fourth quarter this year.