After its debut at IFA 2017 at Berlin, Huawei finally introduces its Kirin 970 SoC in Malaysia through a private session. The Kirin 970 will be the first mobile chipset to feature built-in artificial intelligence (AI), which Huawei views as the next step smartphones should be taking.

Featuring a 12-core integrated GPU, better power management (10nm) and improved LTE stablity with Cat 18 support, the Kirin 970 is slated to be the state-of-the-art chipset to come out from Huawei. It also comes with a neural processing unit (NPU), which allows Huawei smartphones to take on AI-based tasks like optimising the phone’s performance and sorting and recognising pictures.

Eric Zhou, product Managing Director of Huawei’s Wireless Terminal Chipset Division also gave a demonstration on just how powerful the Kirin 970 chipset is what seems to be a sample of the upcoming Mate 10. The phone was paired against a popular Korean smartphone to test just how well it performs.