Qualcomm had somewhat of an eventful day at Snapdragon Tech Summit 2019 as they introduced three new Snapdragon processors; The Snapdragon 865, 765, and 765G. But that’s wasn’t all they had. Oh no no, they came out swinging in Hawaii that day, as they introduced. Brand New ultrasonic fingerprint sensor called 3D Sonic Max.
The new 3D Sonic Max apparently has a 17 times larger recognition area from it’s previous ultrasonic fingerprint sensor. According to them, anyway. They also went out to claim it’s new sensors was the largest of its kind in the world. 
But size isn’t all the new 3D Sonic Max has, as it’s apparently also more accurate, and due to its size, is going to be able to process TWO fingers simultaneously. They do go on to say that this has other applications in other areas such as medical, IoT, automotive, etc. So it’s not only for smartphones, but could you imagine? That’s some top tier security, but I’d assume that’d be a hassle. It would depend on how it was implemented by manufacturers after the fact. They didn’t reveal any timeline for it’s release of the 3D Sonic Max, so it could be awhile before we see this tech implemented widely.
