Intel is seeing a trend and is working on a new line of processors to tap into this. As notebooks become thinner and lighter, hardware manufacturers of these devices face an issue with the performance of the CPU and GPU. Heavy duty performance devices are usually above the 16mm range like gaming notebooks and thicker desktops due to the components being larger.
But change is coming, Intel has a new product that is reducing the usual silicon footprint to less than half that of standard discrete components on motherboards, which would provide OEMs to deliver thin and light designs with improved thermal dissipation. It also delivers space to add new features, create new board layouts, explore new cooling solutions or increase battery life.
The new product, which will be part of our 8th Gen Intel Core family, brings together high-performing Intel Core H-series processor, second generation High Bandwidth Memory (HBM2) and a custom-to-Intel third-party discrete graphics chip from AMD’s Radeon Technologies Group.
Making the new product Intel sought the collaboration of the team at AMD’s Radeon Technologies Group. In close collaboration, they were able to design a new semi-custom graphics chip. Together they are offering gamers and content creators to have thinner-and-lighter PC capable of delivering discrete performance-tier graphics experiences in AAA games and content creation applications.